

CYV15G0402DXB-BGXC
CYV15G0402DXB-BGXC
IC SERDES HOTLINK II 256LBGA
In Stock:
11937
Pricing
QTY | UNIT PRICE | EXT PRICE |
---|---|---|
1 | 67.3846 | |
10 | 66.0369 | |
100 | 64.0154 | |
1000 | 61.9939 | |
10000 | 59.2985 |
Specifications
Mount | Surface Mount |
---|---|
Width | 27mm |
Length | 27mm |
Series | HOTlink II™ |
Data Rate | 1.5 Gbps |
Interface | LVTTL |
Lead Free | Lead Free |
Packaging | Tray |
Pin Count | 256 |
Published | 2003 |
Technology | BICMOS |
Part Status | Obsolete |
RoHS Status | ROHS3 Compliant |
Subcategory | Network Interfaces |
JESD-609 Code | e1 |
Mounting Type | Surface Mount |
Terminal Form | BALL |
Number of Pins | 256 |
Package / Case | 256-LBGA Exposed Pad |
Power Supplies | 3.3V |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Telecom IC Type | TELECOM CIRCUIT |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Base Part Number | CY*15G04 |
Current - Supply | 830mA |
Voltage - Supply | 3.135V~3.465V |
Terminal Position | BOTTOM |
Number of Circuits | 4 |
Number of Functions | 1 |
Qualification Status | Not Qualified |
Operating Temperature | 0°C~70°C |
Reach Compliance Code | not_compliant |
Nominal Supply Current | 1.06A |
Number of Terminations | 256 |
Number of Transceivers | 4 |
Peak Reflow Temperature (Cel) | 260 |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Time@Peak Reflow Temperature-Max (s) | 20 |