XC17S10XLPDG8C
RoHS

XC17S10XLPDG8C

XC17S10XLPDG8C

Xilinx

IC PROM PROG C-TEMP 3.3V 8-DIP

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XC17S10XLPDG8C

In Stock: 19570
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Shipping Information
Shiped FromShenZhen Warehourse
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Specifications
Width7.62mm
Length9.3599mm
I/O TypeCOMMON
ECCN CodeEAR99
PackagingTube
Pin Count8
Published1999
TechnologyCMOS
Memory Size100kb
Part StatusObsolete
RoHS StatusRoHS Compliant
Memory Width1
Organization95752X1
JESD-609 Codee3
Mounting TypeThrough Hole
Surface MountNO
Memory Density95752 bit
Memory IC TypeMEMORY CIRCUIT
Number of Pins8
Operating ModeSYNCHRONOUS
Package / Case8-DIP (0.300, 7.62mm)
Power Supplies3.3V
Supply Voltage3.3V
Terminal Pitch2.54mm
Clock Frequency10MHz
Terminal FinishMatte Tin (Sn)
Base Part NumberXC17S10XL
Voltage - Supply3V~3.6V
Programmable TypeOTP
Terminal PositionDUAL
Supply Current-Max0.005mA
Height Seated (Max)4.5974mm
Number of Functions1
Standby Current-Max0.00005A
Qualification StatusNot Qualified
Operating Temperature0°C~70°C
Reach Compliance Codeunknown
Number of Terminations8
Output Characteristics3-STATE
Supply Voltage-Max (Vsup)3.6V
Supply Voltage-Min (Vsup)3V
Peak Reflow Temperature (Cel)250
Moisture Sensitivity Level (MSL)1 (Unlimited)
Time@Peak Reflow Temperature-Max (s)30