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19529
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Specifications
Width | 8.9662mm |
---|---|
Length | 8.9662mm |
Density | 1 Mb |
HTS Code | 8542.39.00.01 |
ECCN Code | 3A001.B.1.A |
Endurance | 10000 Write/Erase Cycles |
Lead Free | Contains Lead |
Packaging | Tube |
Pin Count | 20 |
Published | 1999 |
Technology | CMOS |
Part Status | Obsolete |
RoHS Status | Non-RoHS Compliant |
Subcategory | Flash Memories |
Memory Width | 8 |
Organization | 128KX8 |
JESD-609 Code | e0 |
Mounting Type | Surface Mount |
Surface Mount | YES |
Terminal Form | J BEND |
Memory IC Type | CONFIGURATION MEMORY |
Number of Pins | 20 |
Package / Case | 20-LCC (J-Lead) |
Supply Voltage | 3.3V |
Terminal Pitch | 1.27mm |
Clock Frequency | 33MHz |
Parallel/Serial | PARALLEL/SERIAL |
Terminal Finish | Tin/Lead (Sn85Pb15) |
Base Part Number | XC18V01 |
Voltage - Supply | 3V~3.6V |
Access Time (Max) | 15 ns |
Programmable Type | In System Programmable |
Terminal Position | QUAD |
Supply Current-Max | 0.025mA |
Height Seated (Max) | 4.572mm |
Number of Functions | 1 |
Radiation Hardening | No |
Standby Current-Max | 0.01A |
Operating Temperature | -40°C~85°C |
Number of Terminations | 20 |
Data Retention Time-Min | 10 |
Operating Supply Voltage | 3.3V |
Supply Voltage-Max (Vsup) | 3.6V |
Supply Voltage-Min (Vsup) | 3V |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |