XC7Z045-3FBG676E
RoHS

XC7Z045-3FBG676E

XC7Z045-3FBG676E

Xilinx

IC SOC CORTEX-A9 KINTEX7 676FBGA

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XC7Z045-3FBG676E

In Stock: 312
Pricing
QTY UNIT PRICE EXT PRICE
1 1560.16
10 1528.9568
100 1482.152
1000 1435.3472
10000 1372.9408
Shipping Information
Shiped FromShenZhen Warehourse
Lead TimeCall right now
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Specifications
Length27mm
SeriesZynq®-7000
HTS Code8542.39.00.01
RAM Size256KB
ECCN Code3A991.D
Frequency1GHz
InterfaceCAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
PackagingTray
Published2009
TechnologyCMOS
Memory TypeROMless
Part StatusActive
PeripheralsDMA
RAM (words)256000
RoHS StatusROHS3 Compliant
Speed Grade-3
ArchitectureMCU, FPGA
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
JESD-30 CodeS-PBGA-B676
Boundary ScanYES
JESD-609 Codee1
Number of I/O130
Surface MountYES
Terminal FormBALL
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Data Bus Width32b
Package / Case676-BBGA, FCBGA
Supply Voltage1V
Terminal Pitch1mm
Contact PlatingCopper, Silver, Tin
Terminal FinishTin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Base Part NumberXC7Z045
Bus CompatibilityCAN; ETHERNET; I2C; SPI; UART; USB
Core ArchitectureARM
Factory Lead Time10 Weeks
Terminal PositionBOTTOM
Primary AttributesKintex™-7 FPGA, 350K Logic Cells
Height Seated (Max)2.54mm
Radiation HardeningNo
Operating Temperature0°C~100°C TJ
Number of Terminations676
Operating Supply Voltage1V
Supply Voltage-Max (Vsup)1.05V
Peak Reflow Temperature (Cel)245
Moisture Sensitivity Level (MSL)3 (168 Hours)
Time@Peak Reflow Temperature-Max (s)30